Showing results: 331 - 345 of 410 items found.
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JT 2149/DAF -
JTAG Technologies Inc.
The JT 2149/DAF is a compact, mixed-signal (Digital/Analog/Frequency) measurement module for use in JTAG Technologies’ widely-used JT 2147 (QuadPod) signal conditioning interface. The DAF module has been designed to replace a regular TAP Pod and provides 28 measurement channels plus a clock generator. When connected to a circuit board via edge connector or test fixture/jig test pins, the module enhances standard digital boundary-scan tests by enabling a series of analog and frequency measurements to be made.
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Cortek Test Solutions
Our test fixture kits provide cost effective solutions to printed circuit board testing and other devices under test. Our modular kits are available in multiple sizes and configurations. They can easily be customized if our standard doesn’t meet your requirements. Removable side panels for ease of fabrication for I/O connections, switches or other hardware.
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SYSTEM 8 (BFL) -
ABI Electronics Ltd
The SYSTEM 8 Board Fault Locator provides the user with the ability to functionally test all common digital ICs in and out-of-circuit. A combination of industry recognised test techniques provides a high level of fault coverage. Additional tools are provided by the SYSTEM 8 Premier software to further enhance the unit\'s wide range of applications.
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Introspect Technology, Inc.
PCI Express (PCIe) is a highly successful SerDes interface that is used in computing devices spanning a wide range of applications. Currently in its fourth generation with on-going roadmap development for a fifth generation, the PCIe interface is undergoing major technical advancements that require state-of-the-art development and validation tools. For example, Gen4 PCIe devices operate at 16 Gbps per lane and are expected to deliver very low bit error rate (BER) levels even over constrained and lossy transmission channels (e.g. printed circuit boards).
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ESD -
Altair Feko
Smart connected devices are everywhere, in homes, in transportation, and at work. This means electronic system design (ESD) is having a greater influence on almost every type of product requiring new simulation tools to help achieve electronic, electrical, mechanical, thermal, and connectivity goals. Altair’s simulation-driven design tools enable your team of specialized engineers to collaborate across all aspects of printed circuit board development from concept to manufacturing. Our products streamline your process, eliminate design iterations, and reduce time-to-market.
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ESD -
Altair Engineering, Inc.
Smart connected devices are everywhere, in homes, in transportation, and at work. This means electronic system design (ESD) is having a greater influence on almost every type of product requiring new simulation tools to help achieve electronic, electrical, mechanical, thermal, and connectivity goals. Altair’s simulation-driven design tools enable your team of specialized engineers to collaborate across all aspects of printed circuit board development from concept to manufacturing. Our products streamline your process, eliminate design iterations, and reduce time-to-market.
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Petracarbon Pte Ltd
IndustriesProducts and ServicesPetracarbon is an international provider of focused and robust Automatic Test Equipment or ATE solutions designed to enable mobile, semiconductor, power, RF and circuit board companies to implement top quality test strategies to lower their cost of test.Petracarbon Fixture Group provides support for PCBA Manufacturing Test Requirements. We provide sales, programming, engineering, manufacturing and service centers in Asia.
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40-115-122 -
Pickering Interfaces Ltd.
Available in normally open (DPST & SPST) configurations. Connections are made via a front panel micro-D 96-pin male connector. For applications requiring improved bandwidth and crosstalk performance please look at our 40-120 and 40-125 range of shielded reed relay cards. General purpose reed relays are suitable for the construction of small switching networks, slaving up to larger switches or operating external devices (e.g. lamps, solenoids etc.). To simplify inter-relay wiring, interconnection points are built onto the circuit board easing the construction of complicated wiring.
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Santa Barbara Infrared, Inc.
The FPA Test Set (FPATS) interface to the detectors under test (DUT’s) is via a custom pedestal plate which provides both a conductive heat path to both the individual DUT’s as well as the field of view limiting aperture plate. This custom pedestal plate protrudes through the customer provided DUT interface printed circuit board (PCB) and makes physical contact with the rear of the DUT packages and the aperture plate when the FPATS is in the closed position. The pedestal plate is mounted to the ambient source plate and its temperature is actively driven by this subsystem.
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40-115-021 -
Pickering Interfaces Ltd.
Available in normally open (DPST & SPST) configurations. Connections are made via a front panel micro-D 96-pin male connector. For applications requiring improved bandwidth and crosstalk performance please look at our 40-120 and 40-125 range of shielded reed relay cards. General purpose reed relays are suitable for the construction of small switching networks, slaving up to larger switches or operating external devices (e.g. lamps, solenoids etc.). To simplify inter-relay wiring, interconnection points are built onto the circuit board easing the construction of complicated wiring.
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40-550-002 -
Pickering Interfaces Ltd.
Connections are made via a front panel 37-way D-Type male connector or two 20-way GMCT male connectors. Used for switching inductive/capacitive loads up to 5A at 250VAC. Power matrix modules are intended for switching heavy AC or DC loads or for slaving up to large external relays, contactors and solenoids. Used for applications requiring switching of either mains voltage or direct current. These modules are fitted with electro-mechanical power relays, gold-flash over silver alloy. A spare relay is built onto the circuit board to facilitate easy maintenance with minimum downtime.
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Wewon Environmental Chambers Co, Ltd.
In Wewon, We have 2 powerful Vibration Testing Equipment. The Vibration Testing Equipment A is : EV210H0808VCSusb-E; The Vibration Testing Equipment B is: EV232H0809VCSusb-E. Technical parameters as below blank forms mentioned, The mainly difference is Sine Excitation Force, Frequency Range, Vibration Table’s size. Application for Vibration Test Equipment : The vibration test is to inspire or impact a part or device to see how it reacts in a real environment. The application of vibration test is very extensive, from the circuit board, aircraft, ships, rockets, missiles, automobiles and household appliances and other industrial products.
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HD-T1 -
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Environment Associates Inc.
We service most industry segments with harsh environment, salt fog corrosion testing.If your product is coated or painted for the marine, automotive or military industries, we are equipped to provide accredited testing within multiple chambers.We provide ASTM sample preparation for coated and painted articles to ensure that your test is performed correctly.We also provide custom configurations with varied salt concentrations and temperatures for many customers with products that are used in unique environments. Products like circuit boards, electronic devices and sensors may all have specialized testing requirements.
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National Technical Systems
NTS electronics failure analysis capabilities can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices as well as materials and assemblies.Electronics F/A can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a F/A should be performed to identify the root cause of failure. The information presented in the root cause F/A will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased F/A performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.
